Know-how
Process Engineering Systems.
The cleaning and etching system for silicon wafers combines the latest process technology with proven techniques and high flexibility. Its modular design enables a configuration tailored to customer needs. Integrated cleanroom technology ensures optimal cleaning and etching performance while reducing costs—since a cleanroom is only required at the output station.
- Sample Version – Ultrasonic Cleaning
- Hot Water Dryer, Hot Air Dryer
- Etching Baths
- Stainless Steel or Plastic
Latest Technology
Cleaning & Etching System
As with our wet process systems, we also offer a modular design for these systems. This facilitates easier installation and allows for system expansion in case of process changes or increased production demands.
Thanks to their high level of automation, our systems require minimal personnel. Frequently, they are connected directly to a cleanroom at the output section.
A high throughput of components, supported by oscillating product movement and advanced rinsing technology, completes the concept. Maintenance is quick and easy thanks to numerous access points and optimized equipment placement.